Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-314-41-605000

110-91-314-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,062 -

RFQ

110-91-314-41-605000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-107-41-005000

317-93-107-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
2,560 -

RFQ

317-93-107-41-005000

Scheda tecnica

Bulk 317 Active SIP 7 (1 x 7) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-306-41-007000

116-93-306-41-007000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
3,611 -

RFQ

116-93-306-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-41-007000

116-43-306-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,377 -

RFQ

116-43-306-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-318-41-001000

210-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,050 -

RFQ

210-41-318-41-001000

Scheda tecnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-318-41-001000

210-91-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,118 -

RFQ

210-91-318-41-001000

Scheda tecnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-31-007000

614-41-306-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,442 -

RFQ

614-41-306-31-007000

Scheda tecnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-306-31-007000

614-91-306-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,854 -

RFQ

614-91-306-31-007000

Scheda tecnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-304-61-008000

116-43-304-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,944 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-304-61-008000

116-93-304-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,161 -

RFQ

Tube * Active - - - - - - - - - - - - - -
APA-324-G-A1

APA-324-G-A1

ADAPTER PLUG

Samtec Inc.
3,970 -

RFQ

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-624-G-A1

APA-624-G-A1

ADAPTER PLUG

Samtec Inc.
2,369 -

RFQ

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
110-93-314-10-002000

110-93-314-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
3,934 -

RFQ

110-93-314-10-002000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-41-001000

614-41-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,562 -

RFQ

614-41-306-41-001000

Scheda tecnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-306-41-001000

614-91-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,008 -

RFQ

614-91-306-41-001000

Scheda tecnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-324-41-001000

210-47-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,356 -

RFQ

210-47-324-41-001000

Scheda tecnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-624-41-001000

210-47-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,756 -

RFQ

210-47-624-41-001000

Scheda tecnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-47-424-41-001000

210-47-424-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,710 -

RFQ

210-47-424-41-001000

Scheda tecnica

Tube 210 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-320-41-003000

115-44-320-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,284 -

RFQ

115-44-320-41-003000

Scheda tecnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
37-PGM10012-10

37-PGM10012-10

CONN SOCKET PGA GOLD

Aries Electronics
3,289 -

RFQ

37-PGM10012-10

Scheda tecnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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