Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-47-316-41-605000

110-47-316-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,594 -

RFQ

110-47-316-41-605000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-314-41-001000

111-41-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,104 -

RFQ

111-41-314-41-001000

Scheda tecnica

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-314-41-001000

111-91-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,739 -

RFQ

111-91-314-41-001000

Scheda tecnica

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-316-10-003000

110-93-316-10-003000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,381 -

RFQ

110-93-316-10-003000

Scheda tecnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-308-41-007000

116-41-308-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,690 -

RFQ

116-41-308-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-308-41-007000

116-91-308-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,308 -

RFQ

116-91-308-41-007000

Scheda tecnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6810-90T

16-6810-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics
3,468 -

RFQ

16-6810-90T

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-6823-90

16-6823-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,417 -

RFQ

16-6823-90

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
16-2822-90C

16-2822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,681 -

RFQ

16-2822-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-2823-90C

16-2823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,154 -

RFQ

16-2823-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-4820-90C

16-4820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,727 -

RFQ

16-4820-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-4822-90C

16-4822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,173 -

RFQ

16-4822-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-4823-90C

16-4823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,686 -

RFQ

16-4823-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6820-90C

16-6820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,907 -

RFQ

16-6820-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6822-90C

16-6822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,481 -

RFQ

16-6822-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6823-90C

16-6823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,682 -

RFQ

16-6823-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-210-41-003000

116-93-210-41-003000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,967 -

RFQ

116-93-210-41-003000

Scheda tecnica

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-210-41-003000

116-43-210-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,791 -

RFQ

116-43-210-41-003000

Scheda tecnica

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-149-15-063135

546-87-149-15-063135

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,053 -

RFQ

546-87-149-15-063135

Scheda tecnica

Bulk 546 Active PGA 149 (15 x 15) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-149-15-063136

546-87-149-15-063136

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,892 -

RFQ

546-87-149-15-063136

Scheda tecnica

Bulk 546 Active PGA 149 (15 x 15) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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