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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
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16-810-90WRCONN IC DIP SOCKET 16POS GOLD Aries Electronics |
3,196 | - |
RFQ |
Scheda tecnica |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
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40-6518-10ECONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,482 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3503-20CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,188 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3503-30CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,493 | - |
RFQ |
Scheda tecnica |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
58-1518-00CONN IC DIP SOCKET 58POS GOLD Aries Electronics |
3,901 | - |
RFQ |
Scheda tecnica |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 58 (2 x 29) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-81000-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,028 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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18-81125-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,437 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-81180-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,102 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-81240-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,198 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-81250-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,683 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8355-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,820 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8375-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,052 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
18-8400-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,799 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8470-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,838 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8500-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,793 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8510-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,450 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8532-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,874 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8540-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,020 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8545-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,477 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-8560-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,323 | - |
RFQ |
Scheda tecnica |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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