Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-8590-610C

18-8590-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,187 -

RFQ

18-8590-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8600-610C

18-8600-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,964 -

RFQ

18-8600-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8640-610C

18-8640-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,258 -

RFQ

18-8640-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8650-610C

18-8650-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,401 -

RFQ

18-8650-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8670-610C

18-8670-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
3,228 -

RFQ

18-8670-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8685-610C

18-8685-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,939 -

RFQ

18-8685-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8700-610C

18-8700-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
3,010 -

RFQ

18-8700-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8750-610C

18-8750-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,231 -

RFQ

18-8750-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-8870-610C

18-8870-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,128 -

RFQ

18-8870-610C

Scheda tecnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0501-20

22-0501-20

CONN SOCKET SIP 22POS TIN

Aries Electronics
2,138 -

RFQ

22-0501-20

Scheda tecnica

Bulk 501 Active SIP 22 (1 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-0501-30

22-0501-30

CONN SOCKET SIP 22POS TIN

Aries Electronics
2,796 -

RFQ

22-0501-30

Scheda tecnica

Bulk 501 Active SIP 22 (1 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6810-90

16-6810-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,736 -

RFQ

16-6810-90

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
24-3572-10

24-3572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
2,624 -

RFQ

24-3572-10

Scheda tecnica

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3573-10

24-3573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,081 -

RFQ

24-3573-10

Scheda tecnica

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3574-10

24-3574-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,534 -

RFQ

24-3574-10

Scheda tecnica

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3575-10

24-3575-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
2,427 -

RFQ

24-3575-10

Scheda tecnica

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6571-10

24-6571-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,531 -

RFQ

24-6571-10

Scheda tecnica

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3571-10

24-3571-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics
3,228 -

RFQ

24-3571-10

Scheda tecnica

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
26-6820-90C

26-6820-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
2,086 -

RFQ

26-6820-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-6822-90C

26-6822-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics
2,739 -

RFQ

26-6822-90C

Scheda tecnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
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