Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-41-064-10-051001

510-41-064-10-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,274 -

RFQ

510-41-064-10-051001

Scheda tecnica

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
77-PGM10015-11

77-PGM10015-11

CONN SOCKET PGA GOLD

Aries Electronics
3,782 -

RFQ

77-PGM10015-11

Scheda tecnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-179-15-041112

614-83-179-15-041112

CONN SOCKET PGA 179POS GOLD

Preci-Dip
2,086 -

RFQ

614-83-179-15-041112

Scheda tecnica

Bulk 614 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-C212-31

24-C212-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,086 -

RFQ

24-C212-31

Scheda tecnica

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-21

24-C300-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,171 -

RFQ

24-C300-21

Scheda tecnica

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-31

24-C300-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,597 -

RFQ

24-C300-31

Scheda tecnica

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-11-952-41-001000

122-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,471 -

RFQ

122-11-952-41-001000

Scheda tecnica

Tube 122 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-87-255M16-001148

514-87-255M16-001148

CONN SOCKET BGA 255POS GOLD

Preci-Dip
3,563 -

RFQ

514-87-255M16-001148

Scheda tecnica

Bulk 514 Active BGA 255 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-391-18-101111

517-83-391-18-101111

CONN SOCKET PGA 391POS GOLD

Preci-Dip
3,402 -

RFQ

517-83-391-18-101111

Scheda tecnica

Bulk 517 Active PGA 391 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-044-08-031001

510-93-044-08-031001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,322 -

RFQ

510-93-044-08-031001

Scheda tecnica

Bulk 510 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-044-08-031002

510-93-044-08-031002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,402 -

RFQ

510-93-044-08-031002

Scheda tecnica

Bulk 510 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-044-08-031003

510-93-044-08-031003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,046 -

RFQ

510-93-044-08-031003

Scheda tecnica

Bulk 510 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-322-61-801000

110-43-322-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,022 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-322-61-801000

110-93-322-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,973 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-41-065-10-051001

510-41-065-10-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,799 -

RFQ

510-41-065-10-051001

Scheda tecnica

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-056-09-041001

510-91-056-09-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,076 -

RFQ

510-91-056-09-041001

Scheda tecnica

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-328-61-003000

116-93-328-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,984 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-428-61-003000

116-93-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,692 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-628-61-003000

116-93-628-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,507 -

RFQ

Tube * Active - - - - - - - - - - - - - -
84-PGM13042-50

84-PGM13042-50

CONN SOCKET PGA GOLD

Aries Electronics
3,461 -

RFQ

84-PGM13042-50

Scheda tecnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 602603604605606607608609...1100Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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