+86 075582561136
Carica BOM
Zoccoli per IC, transistor
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-43-636-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,779 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-636-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,399 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
510-41-068-10-001001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,659 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-068-10-041001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,099 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-068-11-001001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,515 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-068-11-061001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,282 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
27-0511-11CONN SOCKET SIP 27POS GOLD Aries Electronics |
3,861 | - |
RFQ |
Scheda tecnica |
Bulk | 511 | Active | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6508-212CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,462 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-43-318-61-801000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,727 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-318-61-801000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,247 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
117-43-316-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,054 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-41-964-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,528 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-91-964-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,481 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-43-640-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,818 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-640-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,649 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
517-83-372-19-111111CONN SOCKET PGA 372POS GOLD Preci-Dip |
3,792 | - |
RFQ |
Scheda tecnica |
Bulk | 517 | Active | PGA | 372 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-41-069-11-061001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,012 | - |
RFQ |
Scheda tecnica |
Bulk | 510 | Active | PGA | 69 (11 x 11) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
20-4508-21CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,685 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-4508-31CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,390 | - |
RFQ |
Scheda tecnica |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-91-069-11-061001SOCKET SOLDERTAIL 69-PGA Mill-Max Manufacturing Corp. |
2,895 | - |
RFQ |
Bulk | 510 | Active | PGA | 69 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
- 1500+ Media giornaliera RFQ
- 20,000.000 Unità prodotto standard
- 1800+ Produttori mondiali
- 15,000+ Magazzino in stock
