Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1-390261-9

1-390261-9

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,792 -

RFQ

1-390261-9

Scheda tecnica

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze -
1-822473-4

1-822473-4

CONN SOCKET PLCC 44POS TIN

TE Connectivity AMP Connectors
2,325 -

RFQ

1-822473-4

Scheda tecnica

Box - Obsolete PLCC 44 (4 x 11) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic
1-1825093-1

1-1825093-1

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,247 -

RFQ

1-1825093-1

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1825093-1

1825093-1

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,261 -

RFQ

1825093-1

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-3

1825093-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
2,562 -

RFQ

1825093-3

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-4

1825093-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,030 -

RFQ

1825093-4

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-5

1825093-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,462 -

RFQ

1825093-5

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825093-6

1825093-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,219 -

RFQ

1825093-6

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825094-6

1825094-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,711 -

RFQ

1825094-6

Scheda tecnica

Tube,Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825094-7

1825094-7

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,897 -

RFQ

1825094-7

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825108-2

1825108-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,353 -

RFQ

1825108-2

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825109-2

1825109-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,073 -

RFQ

1825109-2

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825108-3

1825108-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
2,308 -

RFQ

1825108-3

Scheda tecnica

Tube,Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1-1825093-2

1-1825093-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,319 -

RFQ

1-1825093-2

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825094-3

1-1825094-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
2,670 -

RFQ

1-1825094-3

Scheda tecnica

Tube,Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825094-4

1-1825094-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
2,393 -

RFQ

1-1825094-4

Scheda tecnica

Tube,Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825094-7

1-1825094-7

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,956 -

RFQ

1-1825094-7

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825109-2

1-1825109-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,600 -

RFQ

1-1825109-2

Scheda tecnica

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825276-2

1-1825276-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
3,132 -

RFQ

1-1825276-2

Scheda tecnica

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825109-3

1-1825109-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,860 -

RFQ

1-1825109-3

Scheda tecnica

Tube,Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
Total 955 Record«Prev1... 89101112131415...48Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

Home

Fudong Communication (Shenzhen) Group Co., Ltd.

Prodotto

Fudong Communication (Shenzhen) Group Co., Ltd.

Telefono

Fudong Communication (Shenzhen) Group Co., Ltd.

Utente