Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
3-1437536-4

3-1437536-4

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors
2,050 -

RFQ

3-1437536-4

Scheda tecnica

Tube 500 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
3-1437538-2

3-1437538-2

CONN IC DIP SOCKET 40POS TINLEAD

TE Connectivity AMP Connectors
2,152 -

RFQ

3-1437538-2

Scheda tecnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
382437-3

382437-3

CONN SOCKET SIP 3POS TIN

TE Connectivity AMP Connectors
2,613 -

RFQ

382437-3

Scheda tecnica

Tray Diplomate DL Obsolete SIP 3 (1 x 3) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
6-1437536-1

6-1437536-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,606 -

RFQ

6-1437536-1

Scheda tecnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
532-AG11D-ESL

532-AG11D-ESL

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
3,191 -

RFQ

532-AG11D-ESL

Scheda tecnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Copper Alloy Polyester
643653-3

643653-3

CONN SOCKET SIP 21POS TIN

TE Connectivity AMP Connectors
2,139 -

RFQ

643653-3

Scheda tecnica

Tray Diplomate DL Active SIP 21 (1 x 21) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
7-1437532-1

7-1437532-1

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors
3,119 -

RFQ

7-1437532-1

Scheda tecnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Polyester
7-1437539-2

7-1437539-2

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors
3,179 -

RFQ

7-1437539-2

Scheda tecnica

Tube 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
508-AG8D

508-AG8D

CONN IC DIP SOCKET 8POS TIN-LEAD

TE Connectivity AMP Connectors
2,538 -

RFQ

508-AG8D

Scheda tecnica

Tube 500 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead - Copper Alloy Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy -
1825375-3

1825375-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,154 -

RFQ

1825375-3

Scheda tecnica

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825375-2

1825375-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,156 -

RFQ

1825375-2

Scheda tecnica

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1-1825093-6

1-1825093-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,319 -

RFQ

1-1825093-6

Scheda tecnica

Tube Diplomate DL Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1437504-0

1-1437504-0

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors
2,126 -

RFQ

1-1437504-0

Scheda tecnica

Bulk 8060 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
1-1437504-1

1-1437504-1

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors
2,673 -

RFQ

1-1437504-1

Scheda tecnica

Bulk 8060 Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE)
1-1437508-3

1-1437508-3

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors
2,986 -

RFQ

1-1437508-3

Scheda tecnica

Bulk 8058 Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
1-1437532-5

1-1437532-5

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,910 -

RFQ

1-1437532-5

Scheda tecnica

- 500 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - - Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin-Lead - - -
508-AG10D-ESL

508-AG10D-ESL

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,595 -

RFQ

508-AG10D-ESL

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 5.00µin (0.127µm) Brass -
1-1437537-1

1-1437537-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,242 -

RFQ

1-1437537-1

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Surface Mount Open Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic
1-1437537-7

1-1437537-7

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,427 -

RFQ

1-1437537-7

Scheda tecnica

- 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - -
1-1437540-0

1-1437540-0

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors
3,411 -

RFQ

1-1437540-0

Scheda tecnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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