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| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
516-AG10D-ESCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,588 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
7-1437531-8CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
3,584 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
2-1437537-1CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,156 | - |
RFQ |
Scheda tecnica |
Tube,Box | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
2-1571550-2CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
3,027 | - |
RFQ |
Scheda tecnica |
Tube,Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-641616-1CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
3,666 | - |
RFQ |
Scheda tecnica |
Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic |
|
2-1571550-9CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
3,249 | - |
RFQ |
Scheda tecnica |
Tube,Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-1571550-3CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,248 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
5-1571551-0CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,491 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8060-1G13CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
2,712 | - |
RFQ |
Scheda tecnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
3-1437536-8CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,085 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
3-1571550-2CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
2,292 | - |
RFQ |
Scheda tecnica |
Tube,Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8060-1G4CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
3,203 | - |
RFQ |
Scheda tecnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
1571539-2CONN SOCKET PLCC 28POS TIN TE Connectivity AMP Connectors |
3,140 | - |
RFQ |
Scheda tecnica |
Bulk | - | Obsolete | PLCC | 28 (4 x 7) | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled |
|
5-1571551-2CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
2,091 | - |
RFQ |
Scheda tecnica |
Bulk,Tube | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-1571550-8CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,036 | - |
RFQ |
Scheda tecnica |
Tube,Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1-1437536-3CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
2,904 | - |
RFQ |
Scheda tecnica |
- | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | - | - | - | - |
|
8058-1G32CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors |
3,415 | - |
RFQ |
Scheda tecnica |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) |
|
1-1437531-8CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
2,361 | - |
RFQ |
Scheda tecnica |
Bulk,Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
4-1437531-1CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,560 | - |
RFQ |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | - | Copper Alloy | - | |
|
4-1571551-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
2,716 | - |
RFQ |
Scheda tecnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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