Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
2-1571550-4

2-1571550-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
2,003 -

RFQ

2-1571550-4

Scheda tecnica

Tube,Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571550-5

2-1571550-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,775 -

RFQ

2-1571550-5

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571550-6

2-1571550-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,868 -

RFQ

2-1571550-6

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1825088-4

1825088-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,015 -

RFQ

1825088-4

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic
808-AG10D

808-AG10D

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,471 -

RFQ

808-AG10D

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Polyester
816-AG10D

816-AG10D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,309 -

RFQ

816-AG10D

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
818-AG10D

818-AG10D

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,130 -

RFQ

818-AG10D

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
820-AG10D

820-AG10D

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,727 -

RFQ

820-AG10D

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
840-AG10D

840-AG10D

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,242 -

RFQ

840-AG10D

Scheda tecnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
2-1571551-8

2-1571551-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,031 -

RFQ

2-1571551-8

Scheda tecnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571551-3

4-1571551-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,426 -

RFQ

4-1571551-3

Scheda tecnica

Tube,Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
4-1571551-5

4-1571551-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
2,040 -

RFQ

4-1571551-5

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571586-5

2-1571586-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,920 -

RFQ

2-1571586-5

Scheda tecnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3-1571586-6

3-1571586-6

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,479 -

RFQ

3-1571586-6

Scheda tecnica

Bulk,Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
5-1437535-4

5-1437535-4

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors
3,636 -

RFQ

Tube,Box 500 Obsolete SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper -
1825374-3

1825374-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,741 -

RFQ

1825374-3

Scheda tecnica

Tube Diplomate DL Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825374-4

1825374-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,799 -

RFQ

1825374-4

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
643642-6

643642-6

CONN SOCKET SIP 10POS TIN

TE Connectivity AMP Connectors
3,770 -

RFQ

643642-6

Scheda tecnica

Box Diplomate DL Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
822475-3

822475-3

CONN SOCKET PLCC 32POS TIN

TE Connectivity AMP Connectors
3,454 -

RFQ

822475-3

Scheda tecnica

Tube - Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
1571539-1

1571539-1

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors
3,958 -

RFQ

1571539-1

Scheda tecnica

Bulk - Obsolete PLCC 20 (4 x 5) 0.100 (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS), Glass Filled
Total 955 Record«Prev1... 2728293031323334...48Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

Home

Fudong Communication (Shenzhen) Group Co., Ltd.

Prodotto

Fudong Communication (Shenzhen) Group Co., Ltd.

Telefono

Fudong Communication (Shenzhen) Group Co., Ltd.

Utente