Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1825088-6

1825088-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,303 -

RFQ

1825088-6

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic
1-1825094-6

1-1825094-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,417 -

RFQ

1-1825094-6

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825108-1

1-1825108-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,176 -

RFQ

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1-1825108-3

1-1825108-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,630 -

RFQ

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1825109-1

1825109-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,619 -

RFQ

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
3-1825276-2

3-1825276-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
3,205 -

RFQ

3-1825276-2

Scheda tecnica

Tray Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
1825373-6

1825373-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,168 -

RFQ

1825373-6

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825374-6

1825374-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
2,224 -

RFQ

1825374-6

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
1825412-1

1825412-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,617 -

RFQ

1825412-1

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold - Brass Thermoplastic, Polyester
520-AG12D-LF

520-AG12D-LF

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors
3,415 -

RFQ

520-AG12D-LF

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
382441-3

382441-3

CONN SOCKET SIP 7POS TIN

TE Connectivity AMP Connectors
2,221 -

RFQ

382441-3

Scheda tecnica

Tray Diplomate DL Obsolete SIP 7 (1 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643640-8

643640-8

CONN SOCKET SIP 8POS TIN

TE Connectivity AMP Connectors
2,859 -

RFQ

643640-8

Scheda tecnica

Tray Diplomate DL Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643644-6

643644-6

CONN SOCKET SIP 12POS TIN

TE Connectivity AMP Connectors
3,634 -

RFQ

643644-6

Scheda tecnica

Tray Diplomate DL Obsolete SIP 12 (1 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643645-3

643645-3

CONN SOCKET SIP 13POS TIN

TE Connectivity AMP Connectors
3,592 -

RFQ

643645-3

Scheda tecnica

Tray Diplomate DL Obsolete SIP 13 (1 x 13) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643649-8

643649-8

CONN SOCKET SIP 17POS TIN

TE Connectivity AMP Connectors
3,061 -

RFQ

643649-8

Scheda tecnica

Tray Diplomate DL Obsolete SIP 17 (1 x 17) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-822064-5

2-822064-5

CONN SOCKET PQFP 132POS TIN-LEAD

TE Connectivity AMP Connectors
2,525 -

RFQ

2-822064-5

Scheda tecnica

Tube - Obsolete QFP 132 (4 x 33) 0.025 (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.025 (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP)
2-1571995-0

2-1571995-0

CONN SOCKET SIP 20POS TIN

TE Connectivity AMP Connectors
3,444 -

RFQ

2-1571995-0

Scheda tecnica

Tube 510 Obsolete SIP 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester
3-1674770-2

3-1674770-2

CONN SOCKET PGA ZIF 478POS GOLD

TE Connectivity AMP Connectors
3,646 -

RFQ

Tape & Reel (TR) - Obsolete PGA, ZIF (ZIP) 478 (26 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1814655-1

1814655-1

CONN SOCKET SIP 4POS GOLD

TE Connectivity AMP Connectors
3,895 -

RFQ

1814655-1

Scheda tecnica

Bulk - Obsolete SIP 4 (1 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester
1-1814655-3

1-1814655-3

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors
2,539 -

RFQ

1-1814655-3

Scheda tecnica

Bulk,Bulk - Obsolete SIP 20 (1 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester
Total 955 Record«Prev1... 3233343536373839...48Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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