Zoccoli per IC, transistor

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1-1747890-2

1-1747890-2

CONN SOCKET LGA 771POS GOLD

TE Connectivity AMP Connectors
2,034 -

RFQ

1-1747890-2

Scheda tecnica

Tray - Obsolete LGA 771 (33 x 33) 0.043 (1.09mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.043 (1.09mm) - - - Thermoplastic
1-2013620-3

1-2013620-3

CONN SOCKET PGA ZIF 988POS GOLD

TE Connectivity AMP Connectors
3,980 -

RFQ

Tape & Reel (TR) - Obsolete PGA, ZIF (ZIP) 988 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
2013620-3

2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors
3,801 -

RFQ

Tape & Reel (TR),Box - Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
2040540-2

2040540-2

CONN SOCKET LGA 1156POS GOLD

TE Connectivity AMP Connectors
3,065 -

RFQ

2040540-2

Scheda tecnica

Tray,Box - Active LGA 1156 (34 x 34) 0.036 (0.91mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
516-AG11D-ES

516-AG11D-ES

DIP SOCKET T/H 16POS

TE Connectivity AMP Connectors
2,265 -

RFQ

516-AG11D-ES

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
1-390262-3

1-390262-3

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors
2,836 -

RFQ

1-390262-3

Scheda tecnica

Tape & Reel (TR),Cut Tape (CT),Box - Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze -
1554116-2

1554116-2

CONN SOCKET LGA 1356POS GOLD

TE Connectivity AMP Connectors
3,933 -

RFQ

1554116-2

Scheda tecnica

Tray - Obsolete LGA 1356 (32 x 41) 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1554116-3

1554116-3

CONN SOCKET LGA 1356POS GOLD

TE Connectivity AMP Connectors
2,557 -

RFQ

1554116-3

Scheda tecnica

Tray - Obsolete LGA 1356 (32 x 41) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
1939737-1

1939737-1

CONN SOCKET LGA 1366POS

TE Connectivity AMP Connectors
2,987 -

RFQ

Tray - Obsolete LGA 1366 (32 x 41) - - - - - - - - - - - -
2069965-1

2069965-1

CONN SOCKET LGA 1155POS GOLD

TE Connectivity AMP Connectors
3,263 -

RFQ

2069965-1

Scheda tecnica

Bulk,Bulk - Active LGA 1155 (40 x 40) 0.036 (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.036 (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
506-AG11D

506-AG11D

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,355 -

RFQ

506-AG11D

Scheda tecnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
506-AG11D-ES

506-AG11D-ES

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
2,984 -

RFQ

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
5-1437530-2

5-1437530-2

CONN IC SIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
2,855 -

RFQ

5-1437530-2

Scheda tecnica

Tube 500 Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead - Brass Polyester
516-AG7D

516-AG7D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,326 -

RFQ

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Copper Alloy Polyester
524-AG11D-ES

524-AG11D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,062 -

RFQ

524-AG11D-ES

Scheda tecnica

Bulk 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
2069189-1

2069189-1

CONN SOCKET LGA 1944POS GOLD

TE Connectivity AMP Connectors
2,331 -

RFQ

2069189-1

Scheda tecnica

Tray - Obsolete LGA 1944 (G34) 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - - Liquid Crystal Polymer (LCP)
2069189-2

2069189-2

CONN SOCKET LGA 1944POS GOLD

TE Connectivity AMP Connectors
3,472 -

RFQ

2069189-2

Scheda tecnica

Tray - Obsolete LGA 1944 (G34) 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - - Liquid Crystal Polymer (LCP)
2-382189-2

2-382189-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
2,366 -

RFQ

2-382189-2

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Beryllium Copper Thermoplastic
2-382468-4

2-382468-4

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,412 -

RFQ

2-382468-4

Scheda tecnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Phosphor Bronze Thermoplastic
2-641262-4

2-641262-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,963 -

RFQ

2-641262-4

Scheda tecnica

Tube Diplomate DL Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Thermoplastic, Glass Filled
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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