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Termico - Dissipatori di calore
| Foto: | Numero parte produttore | Disponibilità | Prezzo | Quantità | Scheda tecnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
7021BGBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,879 | - |
RFQ |
Scheda tecnica |
Bulk | - | Active | Board Level | Bolt On | Rectangular, Fins | 1.450 (36.83mm) | 1.750 (44.45mm) | - | 0.380 (9.65mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | Aluminum | |
|
V2274E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
3,394 | - |
RFQ |
Scheda tecnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.063 (27.00mm) | 1.063 (27.00mm) | - | 0.394 (10.00mm) | - | - | 33.00°C/W | ||
|
XL25-35-35-10CERAMIC HEAT SPREADER 35X35MM GR t-Global Technology |
2,100 | - |
RFQ |
Scheda tecnica |
Tray | XL-25 | Obsolete | Heat Spreader | - | Square | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.394 (10.00mm) | - | - | - | Ceramic | |
|
|
1542026-1HTS519-2U=25MM MTG CLIP ULTEM TE Connectivity AMP Connectors |
2,334 | - |
RFQ |
Bulk | - | Active | - | Clip | Square | 0.984 (25.00mm) | 0.984 (25.00mm) | - | - | - | - | - | - | ||
|
265-118ABHE-22HEATSINK VERT ALUM BLACK TO-220 Wakefield-Vette |
3,487 | - |
RFQ |
Scheda tecnica |
Bulk | 265 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 4.0W @ 56°C | 7.00°C/W @ 200 LFM | 14.00°C/W | Aluminum | |
|
HSE-B20381-035H-02HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices |
2,433 | - |
RFQ |
Scheda tecnica |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 1.500 (38.10mm) | 1.378 (35.00mm) | - | 0.500 (12.70mm) | 6.9W @ 75°C | 3.32°C/W @ 200 LFM | 10.87°C/W | Aluminum Alloy | |
|
HSS25-B20-P51HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices |
3,706 | - |
RFQ |
Scheda tecnica |
Box | HSS | Active | Board Level | PC Pin | Square, Fins | 1.000 (25.40mm) | 1.000 (25.40mm) | - | 1.673 (42.50mm) | 5.88W @ 75°C | 6.30°C/W @ 200 LFM | 12.75°C/W | Aluminum Alloy | |
|
HSE-B20381-035H-01HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices |
3,228 | - |
RFQ |
Scheda tecnica |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 1.500 (38.10mm) | 1.378 (35.00mm) | - | 0.500 (12.70mm) | 7.0W @ 75°C | 2.67°C/W @ 200 LFM | 10.71°C/W | Aluminum Alloy | |
|
HSS12-B20-P95HEAT SINK, STAMPING, TO-220, 19 CUI Devices |
3,022 | - |
RFQ |
Scheda tecnica |
Box | HSS | Active | Board Level, Vertical | PC Pin | Rectangular | 0.866 (22.00mm) | 0.748 (19.00mm) | - | 0.433 (11.00mm) | 2.7W @ 75°C | 10.90°C/W @ 200 LFM | 27.37°C/W | Aluminum Alloy | |
|
V2273E1CPU HEATSINK, CROSS CUT, AL6063 Assmann WSW Components |
3,428 | - |
RFQ |
Scheda tecnica |
Bulk | - | Active | - | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 0.906 (23.00mm) | 0.906 (23.00mm) | - | 0.709 (18.00mm) | - | - | 26.00°C/W | ||
|
|
508600B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,075 | - |
RFQ |
Scheda tecnica |
Bulk | - | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Rectangular, Fins | 1.450 (36.83mm) | 0.530 (13.46mm) | - | 0.190 (4.83mm) | 2.5W @ 80°C | 10.00°C/W @ 700 LFM | 32.00°C/W | Aluminum | |
|
HSE-B381-04HHEAT SINK, EXTRUSION, TO-220/TO- CUI Devices |
2,088 | - |
RFQ |
Scheda tecnica |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.500 (38.10mm) | 0.650 (16.50mm) | - | 0.630 (16.00mm) | 5.9W @ 75°C | 4.44°C/W @ 200 LFM | 12.71°C/W | Aluminum Alloy | |
|
V2199N1-FHEATSINK CPU W/ADHESIVE STAMPED Assmann WSW Components |
2,217 | - |
RFQ |
Scheda tecnica |
Bulk | - | Active | Top Mount | Thermal Tape, Adhesive (Included) | Rectangular, Fins | 1.378 (35.00mm) | 0.866 (22.00mm) | - | 0.394 (10.00mm) | - | - | - | Aluminum Alloy | |
|
|
268-85CTEHEATSINK Wakefield-Vette |
2,818 | - |
RFQ |
Bulk | 268 | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 0.848 (21.55mm) | 0.520 (13.21mm) | - | 0.515 (13.08mm) | 1.0W @ 30°C | 8.00°C/W @ 200 LFM | - | Copper | ||
|
HSS-B20-0508H-01HEATSINK TO-220 7.4W ALUMINUM CUI Devices |
3,442 | - |
RFQ |
Scheda tecnica |
Tray | HSS | Active | Board Level | PC Pin | Rectangular, Fins | 1.000 (25.40mm) | 1.000 (25.40mm) | - | 1.673 (42.50mm) | 7.4W @ 75°C | 3.51°C/W @ 200 LFM | 10.14°C/W | Aluminum | |
|
V7477YHEATSINK ALUM ANOD Assmann WSW Components |
2,756 | - |
RFQ |
Scheda tecnica |
Tray | - | Active | Top Mount | Bolt On and PC Pin | Square, Fins | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.500 (12.70mm) | - | - | 9.00°C/W | Aluminum | |
|
|
5022NGHEATSINK Aavid, Thermal Division of Boyd Corporation |
3,455 | - |
RFQ |
Scheda tecnica |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
|
253-122ABE-22HEATSINK LOW PROFILE Wakefield-Vette |
3,006 | - |
RFQ |
Bulk | 253 | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 1.220 (30.99mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | - | Aluminum | ||
|
581102B00000HEATSINK TO-220 2.5W H=1.5 BLK Aavid, Thermal Division of Boyd Corporation |
2,663 | - |
RFQ |
Scheda tecnica |
Box | - | Active | Board Level, Vertical | Bolt On | Rectangular, Fins | 1.500 (38.10mm) | 0.640 (16.26mm) | - | 0.640 (16.26mm) | 3.0W @ 50°C | 3.00°C/W @ 500 LFM | - | Aluminum | |
|
287-1ABHHEATSINK VERT MT HOLE BLK TO-220 Wakefield-Vette |
2,299 | - |
RFQ |
Scheda tecnica |
Bulk | 287 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.180 (29.97mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 4.0W @ 65°C | 7.80°C/W @ 200 LFM | 16.20°C/W | Aluminum |
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