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Termico - Dissipatori di calore

Numero parte produttore	Disponibilità	Prezzo	Quantità	Scheda tecnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
DHS-B9090-44A HEATSINK ASSY INTEL LGA1366 Delta Electronics	3,208	-	RFQ	Scheda tecnica	Box	-	Active	Board Level	Bolt On	Square	3.543 (90.00mm)	3.543 (90.00mm)	-	1.004 (25.50mm)	-	-	0.27°C/W	Aluminum
HS-XU3-SET-R2 ACC HEATSINK MA-XU3 Enclustra FPGA Solutions	2,318	-	RFQ		Box	Mars XU3	Active	-	-	-	-	-	-	-	-	-	-	-
DHS-B10878-12 HEATSINK Delta Electronics	3,966	-	RFQ		Bulk	-	Active	-	-	-	-	-	-	-	-	-	-	-
40432 BOM HEATSINK PUSH PIN LF 4623 Vicor Corporation	2,878	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-
40531 HEATSINK 19MM W/ GROUNDING TAB Vicor Corporation	2,491	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-
125362 1.45WX36 EXTRUSION 14363 Wakefield-Vette	2,889	-	RFQ	Scheda tecnica	Box	-	Active	Top Mount, Extrusion	Adhesive	Rectangular, Fins	36.000 (914.40mm)	1.450 (36.83mm)	-	0.768 (19.50mm)	-	-	1.05°C/W	Aluminum
433K HEATSINK FOR PWR SEMI Wakefield-Vette	3,821	-	RFQ	Scheda tecnica	Bulk	433	Active	Board Level, Extrusion	Press Fit	Rectangular, Fins	5.000 (127.00mm)	4.750 (120.65mm)	-	3.000 (76.20mm)	50.0W @ 42°C	0.28°C/W @ 250 LFM	-	Aluminum
SKV808012-CU COPPER HEATSINK 80X80X12MM Wakefield-Vette	3,633	-	RFQ	Scheda tecnica	Bulk	SKV	Active	Top Mount, Skived	Push Pin	Square, Fins	3.150 (80.00mm)	3.150 (80.00mm)	-	0.472 (12.00mm)	-	1.20°C/W @ 200 LFM	5.10°C/W	Copper
40483 BOM ASSY 4623 LF PUSH PIN HTSN Vicor Corporation	2,702	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-
8-1542002-2 40MM HS ASSY ULTEM CL TE Connectivity AMP Connectors	500	-	RFQ	Scheda tecnica	Tray,Tray	-	Active	Top Mount	Clip	Cylindrical	-	-	1.375 (34.92mm) OD	0.491 (12.47mm)	-	4.70°C/W @ 200 LFM	9.39°C/W	Aluminum
647058 INTEL XEON CPU COOLER 1U Aavid, Thermal Division of Boyd Corporation	2,613	-	RFQ		Tray	-	Active	Top Mount	Bolt On	Rectangular, Fins	4.252 (108.00mm)	3.071 (78.00mm)	-	0.992 (25.20mm)	-	-	-	-
302NN HEATSINK COMPACT Wakefield-Vette	2,955	-	RFQ	Scheda tecnica	Bulk	302	Active	Board Level, Vertical	Press Fit	Rectangular, Fins	2.000 (50.80mm)	1.500 (38.10mm)	-	2.000 (50.80mm)	15.0W @ 50°C	1.80°C/W @ 250 LFM	-	Aluminum Alloy
40139 BOM, ASSEMBLY, 3623 XF PUSH PI Vicor Corporation	2,938	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-
40704 BOM ASSEMBLY HEATSINK TOP 2361 Vicor Corporation	3,825	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-
303N HEATSINK COMPACT Wakefield-Vette	2,310	-	RFQ	Scheda tecnica	Bulk	303	Active	Board Level, Vertical	Press Fit	Rectangular, Fins	2.000 (50.80mm)	3.000 (76.20mm)	-	2.000 (50.80mm)	15.0W @ 37°C	1.30°C/W @ 250 LFM	-	Aluminum Alloy
2207/PR11B ASSY HEAT SINK Aavid, Thermal Division of Boyd Corporation	2,074	-	RFQ	Scheda tecnica	Bulk	-	Active	-	-	-	-	-	-	-	-	-	-	-
DHS-B9292-05A HEATSINK ASSY INTEL LGA2011 Delta Electronics	3,442	-	RFQ	Scheda tecnica	Box	-	Active	Board Level	Bolt On	Square, Fins	3.602 (91.50mm)	3.602 (91.50mm)	-	2.519 (64.00mm)	-	-	0.17°C/W	Aluminum
441K HEATSINK HIGH PWR RECT/DIODES Wakefield-Vette	2,986	-	RFQ	Scheda tecnica	Bulk	441	Active	Board Level, Extrusion	Press Fit	Rectangular, Fins	5.500 (139.70mm)	4.500 (114.30mm)	-	4.500 (114.30mm)	50.0W @ 34°C	0.30°C/W @ 250 LFM	-	Aluminum
DHS-B10878-48 HEATSINK Delta Electronics	2,604	-	RFQ		Bulk	-	Active	-	-	-	-	-	-	-	-	-	-	-
1-1542002-1 HEAT SINK BGA 37.5MM 2FIN RADIAL TE Connectivity AMP Connectors	3,355	-	RFQ	Scheda tecnica	Box	-	Obsolete	-	Clip	Cylindrical	-	-	1.375 (34.92mm) OD	0.357 (9.07mm)	-	6.30°C/W @ 200 LFM	12.00°C/W	Aluminum