Termico - Dissipatori di calore

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
2170488-6

2170488-6

HEAT SINK

TE Connectivity Raychem Cable Protection
189 -

RFQ

Tray XFP Active Top Mount Adhesive Rectangular, Pin Fins 2.254 (57.25mm) 0.709 (18.00mm) - 0.500 (12.70mm) - - - Aluminum
TX1822B

TX1822B

THERMAL LINK PRESS ON BLK TO-18

CTS Thermal Management Products
490 -

RFQ

TX1822B

Scheda tecnica

Bulk - Obsolete Top Mount Stud Mount Cylindrical - 0.380 (9.65mm) 0.380 (9.65mm) OD - - - - Aluminum
342945

342945

COPPER HEATSINK 60X60X14MM

Aavid, Thermal Division of Boyd Corporation
200 -

RFQ

342945

Scheda tecnica

Tray - Active Top Mount, Skived Push Pin Square, Fins 2.362 (60.00mm) 2.362 (60.00mm) - 0.551 (14.00mm) - 1.70°C/W @ 200 LFM 7.00°C/W Copper
125550

125550

9.80WX12 SCR EXTRUSION XX5735

Wakefield-Vette
2,562 -

RFQ

125550

Scheda tecnica

Box - Active Board Level, Extrusion Press Fit Rectangular, Fins 12.000 (304.80mm) 9.800 (248.92mm) - 2.850 (72.39mm) - - 0.18°C/W Aluminum
127686

127686

11.420 WIDE X 12 FLATBACK HEAT

Wakefield-Vette
3,265 -

RFQ

127686

Scheda tecnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 12.000 (304.80mm) 11.420 (290.07mm) - 2.559 (65.00mm) - - 0.19°C/W Aluminum
125449

125449

10.25WX36 EXTRUSIO 14236 XX5772

Wakefield-Vette
3,894 -

RFQ

125449

Scheda tecnica

Box - Active Top Mount, Extrusion Adhesive Rectangular, Fins 36.000 (914.40mm) 10.250 (260.35mm) - 2.500 (63.50mm) - - 0.18°C/W Aluminum
DV-T268-401E-TR

DV-T268-401E-TR

TO-268 SMD HEAT SINK

Ohmite
5,200 -

RFQ

DV-T268-401E-TR

Scheda tecnica

Tape & Reel (TR) D Active Top Mount Solderable Feet Rectangular, Fins 0.500 (12.70mm) 1.220 (30.99mm) - 0.460 (11.68mm) - - - Aluminum
MPC202025T

MPC202025T

CERAMIC HEAT SINK - FLAT TYPE

AMEC Thermasol
2,769 -

RFQ

MPC202025T

Scheda tecnica

Bulk MPC Active Top Mount - Square 0.787 (20.00mm) 0.787 (20.00mm) - 0.098 (2.50mm) - - - Ceramic
SAR55ASX30MM

SAR55ASX30MM

EXTRUDED HEATSINK 55MM X 30MM

Sarnikon
500 -

RFQ

SAR55ASX30MM

Scheda tecnica

Box 55A Active Board Level PC Pin Rectangular, Fins 1.181 (30.00mm) 2.165 (55.00mm) - 0.630 (16.00mm) - - - Aluminum
MPC222225T

MPC222225T

CERAMIC HEAT SINK - FLAT TYPE

AMEC Thermasol
1,409 -

RFQ

MPC222225T

Scheda tecnica

Bulk MPC Active Top Mount - Square 0.866 (22.00mm) 0.866 (22.00mm) - 0.108 (2.75mm) - - - Ceramic
SAR255ASX25MM

SAR255ASX25MM

EXTRUDED HEATSINK 255MM X 25MM

Sarnikon
500 -

RFQ

SAR255ASX25MM

Scheda tecnica

Box 255AS Active Board Level PC Pin Rectangular, Fins 0.984 (25.00mm) 10.039 (255.00mm) - 0.500 (12.70mm) - - - Aluminum
SAR255ASX35MM

SAR255ASX35MM

EXTRUDED HEATSINK 255MM X 35MM

Sarnikon
500 -

RFQ

SAR255ASX35MM

Scheda tecnica

Box 255AS Active Board Level PC Pin Rectangular, Fins 1.378 (35.00mm) 10.039 (255.00mm) - 0.500 (12.70mm) - - - Aluminum
SAR55ASX50MM

SAR55ASX50MM

EXTRUDED HEATSINK 55MM X 50MM

Sarnikon
500 -

RFQ

SAR55ASX50MM

Scheda tecnica

Box 55A Active Board Level PC Pin Rectangular, Fins 1.969 (50.00mm) 2.165 (55.00mm) - 0.630 (16.00mm) - - - Aluminum
SAR110ASX30MM

SAR110ASX30MM

EXTRUDED HEATSINK 78X30MM

Sarnikon
500 -

RFQ

Bulk 110AS Active Top Mount Thermal Tape, Adhesive Rectangular, Fins 1.181 (30.00mm) 3.071 (78.00mm) - 0.787 (20.00mm) - - - Aluminum
SAR155ASX30MM

SAR155ASX30MM

EXTRUDED HEATSINK 155MM X 30MM

Sarnikon
500 -

RFQ

SAR155ASX30MM

Scheda tecnica

Box 155AS Active Board Level PC Pin Rectangular, Fins 1.181 (30.00mm) 6.102 (155.00mm) - 1.000 (25.40mm) - - - Aluminum
MPC303050WT

MPC303050WT

CERAMIC HEAT SINK - WAVE TYPE

AMEC Thermasol
1,050 -

RFQ

MPC303050WT

Scheda tecnica

Bulk MPC Active Top Mount - Square 1.181 (30.00mm) 1.181 (30.00mm) - 0.211 (5.37mm) - - - Ceramic
SAR155ASX35MM

SAR155ASX35MM

EXTRUDED HEATSINK 155MM X 35MM

Sarnikon
500 -

RFQ

SAR155ASX35MM

Scheda tecnica

Box 155AS Active Board Level PC Pin Rectangular, Fins 1.378 (35.00mm) 6.102 (155.00mm) - 1.000 (25.40mm) - - - Aluminum
DV-T263-401E-TR

DV-T263-401E-TR

TO-263 SMD HEAT SINK

Ohmite
1,800 -

RFQ

DV-T263-401E-TR

Scheda tecnica

Tape & Reel (TR) D Active Top Mount Solderable Feet Rectangular, Fins 0.500 (12.70mm) 1.030 (26.16mm) - 0.460 (11.68mm) - - - Aluminum
SAR110ASX40MM

SAR110ASX40MM

EXTRUDED HEATSINK 78X40MM

Sarnikon
500 -

RFQ

Bulk 110AS Active Top Mount Thermal Tape, Adhesive Rectangular, Fins 1.575 (40.00mm) 3.071 (78.00mm) - 0.787 (20.00mm) - - - Aluminum
CS9461020B*

CS9461020B*

10X10X20MM

Cooling Source
750 -

RFQ

Box * Active - - - - - - - - - - -
Total 113324 Record«Prev1... 5354555657585960...5667Next»
1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

Home

Fudong Communication (Shenzhen) Group Co., Ltd.

Prodotto

Fudong Communication (Shenzhen) Group Co., Ltd.

Telefono

Fudong Communication (Shenzhen) Group Co., Ltd.

Utente