Texas Instruments TDA3MVRBFABFRQ1

Numero parte
TDA3MVRBFABFRQ1
Produttore
Texas Instruments
Categoria:
Embedded – System-on-Chip (SoC)
Imballaggio
367-BFBGA, FCBGA
Scheda tecnica
TDA3MVRBFABFRQ1.pdf
Descrizione
IC SOC PROCESSOR
Quantità

Prezzo unitario$0

Prezzo totale$0

Pagamento
payment
Spedizione
payment

Product details

1. How to order TDA3MVRBFABFRQ1 on Fudong Communication (Shenzhen) Group Co., Ltd.?

Currently, Fudong Communication (Shenzhen) Group Co., Ltd. only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

2. How does Fudong Communication (Shenzhen) Group Co., Ltd. guarantee that TDA3MVRBFABFRQ1 is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the TDA3MVRBFABFRQ1. All suppliers must pass our qualification reviews before they can publish their products including TDA3MVRBFABFRQ1 on Fudong Communication (Shenzhen) Group Co., Ltd.; we pay more attention to the channels and quality of TDA3MVRBFABFRQ1 products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the TDA3MVRBFABFRQ1 price and inventory displayed accurate?

The price and inventory of TDA3MVRBFABFRQ1 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.

Warm Tips: Some orders in certain payment forms may require handling fee.

5. How is the shipping arranged?

Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.

Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of TDA3MVRBFABFRQ1?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the TDA3MVRBFABFRQ1 we delivered, we will accept the replacement or return of the TDA3MVRBFABFRQ1 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of TDA3MVRBFABFRQ1.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as TDA3MVRBFABFRQ1 pin diagram, TDA3MVRBFABFRQ1 datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Immagine DRA829JMTGBALFR TDA3MVRBFABFRQ1 DRA829VMTGBALFRQ1 DRA829JMTGBALFRQ1
Numero parte DRA829JMTGBALFR TDA3MVRBFABFRQ1 DRA829VMTGBALFRQ1 DRA829JMTGBALFRQ1
Produttore Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package/Case 367-BFBGA, FCBGA 367-BFBGA, FCBGA 367-BFBGA, FCBGA 367-BFBGA, FCBGA
Packaging Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR) Tape & Reel (TR)
Series - - - -
ProductStatus Active Active Active Active
Architecture DSP, MPU DSP, MPU DSP, MPU DSP, MPU
CoreProcessor ARM® Cortex®-M4, C66x ARM® Cortex®-M4, C66x ARM® Cortex®-M4, C66x ARM® Cortex®-M4, C66x
FlashSize - - - -
RAMSize 512kB 512kB 512kB 512kB
Peripherals DMA, PWM, WDT DMA, PWM, WDT DMA, PWM, WDT DMA, PWM, WDT
Connectivity CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB
Speed 212.8MHz, 745MHz 212.8MHz, 745MHz 212.8MHz, 745MHz 212.8MHz, 745MHz
PrimaryAttributes - - - -
OperatingTemperature -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ) -40°C ~ 125°C (TJ)

TDA3MVRBFABFRQ1 Informazioni rilevanti

I seguenti componenti sono inclusi "TDA3MVRBFABFRQ1" ISSI, Integrated Silicon Solutions Inc. TDA3MVRBFABFRQ1.

  • Numero parte
  • Produttore
  • Imballaggio
  • Descrizione
Disponibile in magazzino:3,263

Si prega di inviare una RFQ.

Si prega di inviare una RFQ. Risponderemo immediatamente.

Numero parte
Quantità
Prezzo
Contatti
Azienda
E-mail
Contenuto
Disponibile in magazzino:3,263
Quantità Prezzo unitario Prezzo totale
RFQ Aggiungi alla lista RFQ
SC-20100S-A

SC-20100S-A

GHI Electronics, LLC

M2S050-FGG484

M2S050-FGG484

Microchip Technology

MAX32655GXG+

MAX32655GXG+

Analog Devices Inc./Maxim Integrated

30SOC-SC-539

30SOC-SC-539

GHI Electronics, LLC

M2S050T-FGG896

M2S050T-FGG896

Microchip Technology

QN9021/D

QN9021/D

NXP USA Inc.

1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

Home

Fudong Communication (Shenzhen) Group Co., Ltd.

Prodotto

Fudong Communication (Shenzhen) Group Co., Ltd.

Telefono

Fudong Communication (Shenzhen) Group Co., Ltd.

Utente