Termico - Dissipatori di calore

Foto: Numero parte produttore Disponibilità Prezzo Quantità Scheda tecnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
XL25W-TO247-22-17-1

XL25W-TO247-22-17-1

CERAMIC HEAT SPREADER 22X17MM WH

t-Global Technology
882 -

RFQ

XL25W-TO247-22-17-1

Scheda tecnica

Bulk XL-25 Active Heat Spreader Thermal Tape, Adhesive (Included) Rectangular 0.866 (22.00mm) 0.669 (17.00mm) - 0.039 (1.00mm) - - - Ceramic
XL25W-TO3P-25-20-0.64

XL25W-TO3P-25-20-0.64

CERAMIC HEAT SPREADER 25X20MM WH

t-Global Technology
207 -

RFQ

XL25W-TO3P-25-20-0.64

Scheda tecnica

Bulk XL-25 Active Heat Spreader Thermal Tape, Adhesive (Included) Rectangular 0.984 (25.00mm) 0.787 (20.00mm) - 0.025 (0.64mm) - - - Ceramic
XL25W-TO3P-25-20-1

XL25W-TO3P-25-20-1

CERAMIC HEAT SPREADER 25X20MM WH

t-Global Technology
177 -

RFQ

XL25W-TO3P-25-20-1

Scheda tecnica

Bulk XL-25 Active Heat Spreader Thermal Tape, Adhesive (Included) Rectangular 0.984 (25.00mm) 0.787 (20.00mm) - 0.039 (1.00mm) - - - Ceramic
NTE403

NTE403

HEAT SINK PLAST.PWR TRANS

NTE Electronics, Inc
184 -

RFQ

NTE403

Scheda tecnica

Bag - Active Board Level Bolt On Rectangular, Fins 1.000 (25.40mm) 0.710 (18.03mm) - 0.500 (12.70mm) - - 20.30°C/W Aluminum Alloy
ATS-PCB1072

ATS-PCB1072

HEATSINK TO-220 BLACK

Advanced Thermal Solutions Inc.
478 -

RFQ

ATS-PCB1072

Scheda tecnica

Bulk - Active Board Level Bolt On Rectangular, Fins 0.750 (19.05mm) 0.520 (13.21mm) - 0.500 (12.70mm) - 9.50°C/W @ 200 LFM 24.40°C/W Aluminum
NTE448E

NTE448E

CLIP-ON H/S FOR 24PIN DIP

NTE Electronics, Inc
3,335 -

RFQ

NTE448E

Scheda tecnica

Bag - Active Top Mount Press Fit Rectangular, Angled Fins 1.460 (37.08mm) 1.008 (25.60mm) - 0.580 (14.73mm) - - 20.00°C/W Aluminum Alloy
HSS-B20-061H-02

HSS-B20-061H-02

HEATSINK TO-220 2.9W ALUMINUM

CUI Devices
214 -

RFQ

HSS-B20-061H-02

Scheda tecnica

Bag HSS Active Board Level, Vertical PC Pin Rectangular, Fins 0.500 (12.70mm) 0.504 (12.80mm) - 0.748 (19.00mm) 2.9W @ 75°C 7.24°C/W @ 200 LFM 25.92°C/W Aluminum
TGH-0132-01

TGH-0132-01

ALUMINIUM HEAT SINK 19X13.2MM

t-Global Technology
2,504 -

RFQ

TGH-0132-01

Scheda tecnica

Bulk - Active Board Level Bolt On Rectangular, Fins 0.748 (19.00mm) 0.520 (13.21mm) - 0.382 (9.70mm) - - - Aluminum
HSS-B20-095H

HSS-B20-095H

HEATSINK TO-220 4.1W ALUMINUM

CUI Devices
338 -

RFQ

HSS-B20-095H

Scheda tecnica

Bag HSS Active Board Level, Vertical PC Pin Rectangular, Fins 0.441 (11.20mm) 0.866 (22.00mm) - 0.626 (15.90mm) 4.1W @ 75°C 6.50°C/W @ 200 LFM 18.34°C/W Aluminum
HSB13-303014

HSB13-303014

HEAT SINK, BGA, 30.7 X 30.7 X 14

CUI Devices
524 -

RFQ

HSB13-303014

Scheda tecnica

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.209 (30.70mm) 1.209 (30.70mm) - 0.551 (14.00mm) 6.1W @ 75°C 4.70°C/W @ 200 LFM 12.36°C/W Aluminum Alloy
HSS-B20-NP-15

HSS-B20-NP-15

HEATSINK TO-220 4.1W ALUMINUM

CUI Devices
376 -

RFQ

HSS-B20-NP-15

Scheda tecnica

Bag HSS Active Board Level - Rectangular, Fins 0.625 (15.90mm) 0.866 (22.00mm) - 0.440 (11.18mm) 4.1W @ 75°C 6.50°C/W @ 200 LFM 18.34°C/W Aluminum
TGH-0160-01

TGH-0160-01

ALUMINIUM HEAT SINK 16X16MM

t-Global Technology
2,468 -

RFQ

TGH-0160-01

Scheda tecnica

Bulk - Active Top Mount - Square, Fins 0.630 (16.00mm) 0.630 (16.00mm) - 0.433 (11.00mm) - - - Aluminum
HSS06-C20-P32

HSS06-C20-P32

HEAT SINK, STAMPING, TO-220, 27.

CUI Devices
439 -

RFQ

HSS06-C20-P32

Scheda tecnica

Box HSS Active Board Level, Vertical PC Pin Rectangular 1.101 (27.96mm) 0.866 (22.00mm) - 0.375 (9.52mm) 3.0W @ 75°C 10.60°C/W @ 200 LFM 25.35°C/W Copper Alloy
TGH-0190-01

TGH-0190-01

ALUMINIUM HEAT SINK 19X19MM

t-Global Technology
124 -

RFQ

TGH-0190-01

Scheda tecnica

Bulk - Active Top Mount - Square, Fins 0.748 (19.00mm) 0.748 (19.00mm) - 0.197 (5.00mm) - - - Aluminum
TGH-0220-06

TGH-0220-06

ALUMINIUM HEAT SINK 27X22MM

t-Global Technology
3,033 -

RFQ

TGH-0220-06

Scheda tecnica

Bulk - Active Top Mount - Rectangular, Pin Fins 1.063 (27.00mm) 0.866 (22.00mm) - 0.354 (9.00mm) - - - Aluminum
NTE495

NTE495

HEATSINK FOR PLASTIC PWR

NTE Electronics, Inc
3,884 -

RFQ

NTE495

Scheda tecnica

Bag - Active Board Level, Vertical - Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) - - 13.00°C/W Aluminum Alloy
ATS-PCBT1080

ATS-PCBT1080

HEATSINK TO-218/TO-220 BLACK

Advanced Thermal Solutions Inc.
660 -

RFQ

ATS-PCBT1080

Scheda tecnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.772 (45.00mm) 1.220 (30.99mm) - 0.500 (12.70mm) - 9.00°C/W @ 200 LFM 13.00°C/W Aluminum
ATS-PCB1046

ATS-PCB1046

HEATSINK TO-220/TO-218 W/TAB

Advanced Thermal Solutions Inc.
630 -

RFQ

ATS-PCB1046

Scheda tecnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.622 (41.20mm) 1.700 (43.18mm) - 0.500 (12.70mm) - 6.30°C/W @ 200 LFM 8.60°C/W Aluminum
ATS-PCB1048

ATS-PCB1048

HEATSINK TO-220 W/TAB BLACK

Advanced Thermal Solutions Inc.
891 -

RFQ

ATS-PCB1048

Scheda tecnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.678 (42.62mm) 0.984 (25.00mm) - 0.984 (25.00mm) - 8.00°C/W @ 200 LFM 13.00°C/W Aluminum
HSS08-B18-CP

HSS08-B18-CP

HEAT SINK, STAMPING, TO-218, 44.

CUI Devices
990 -

RFQ

HSS08-B18-CP

Scheda tecnica

Box HSS Active Board Level, Vertical PC Pin Square 1.750 (44.45mm) 1.750 (44.45mm) - 0.492 (12.50mm) 10.3W @ 75°C 3.50°C/W @ 200 LFM 7.29°C/W Aluminum Alloy
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1500+
1500+ Media giornaliera RFQ
20,000.000
20,000.000 Unità prodotto standard
1800+
1800+ Produttori mondiali
15,000+
15,000+ Magazzino in stock
Fudong Communication (Shenzhen) Group Co., Ltd.

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